As I Am Bond Leave-In Conditioner (237ml)
Why You’ll Love It:
Powered by advanced Submicron Technology, this lightweight formula penetrates deep into the hair fiber to mend broken bonds and reinforce the hair's structural integrity. It provides a vital first layer of moisture and protection, ensuring your hair remains strong, hydrated, and ready for styling without being weighed down.
Why You’ll Need it:
High-performance treatment designed to repair and protect hair at the molecular level.
How You’ll Use it:
Start with clean, damp hair (ideally after using As I Am Bond Strengthening Shampoo and Conditioner).
Apply a generous amount of leave-in conditioner to your palms and distribute evenly throughout the hair.
Use a wide-tooth comb or your fingers to detangle, working from the ends up toward the roots.
Do not rinse out. Leave the product in to allow the bonding technology to work throughout the day.
Style as usual using your favorite styling products.
Ingredients
Aqua/Water/Eau, Betaine, Cetearyl Alcohol, Cetyl Alcohol, Brassicamido-propyl Dimethylamine, Hydrogenated Polydecene, Moringa Oleifera Leaf Extract, Phyllanthus Emblica Fruit Extract, Ceramide NP, Ceramide EOP, Ceramide AP, Copper Tripeptide-1, Phytosphingosine, Serenoa Serrulata Fruit Extract, Phytosterols, Hydroxypropyl Bislauramide MEA, Hydroxypropyl Bisstearamide MEA, Hydroxypropylgluconamide, Hydroxypropylammonium Gluconate, Biotin, Potassium Olivate, Polyglyceryl-10 Stearate, Stearic Acid, Fragrance/Parfum, Polyquaternium-37 Propylene Glycol Dicaprylate/Dicaprate, PPG-1 Trideceth-6, Polyquaternium-7, Lactic Acid, Caprylyl Glycol, Ethylhexylglycerin, Sodium Benzoate, Potassium Sorbate, Polyacrylamide, Maltodextrin, Limonene
As I Am Bond Leave-In Conditioner (237ml)
Why You’ll Love It:
Powered by advanced Submicron Technology, this lightweight formula penetrates deep into the hair fiber to mend broken bonds and reinforce the hair's structural integrity. It provides a vital first layer of moisture and protection, ensuring your hair remains strong, hydrated, and ready for styling without being weighed down.
Why You’ll Need it:
High-performance treatment designed to repair and protect hair at the molecular level.
How You’ll Use it:
Start with clean, damp hair (ideally after using As I Am Bond Strengthening Shampoo and Conditioner).
Apply a generous amount of leave-in conditioner to your palms and distribute evenly throughout the hair.
Use a wide-tooth comb or your fingers to detangle, working from the ends up toward the roots.
Do not rinse out. Leave the product in to allow the bonding technology to work throughout the day.
Style as usual using your favorite styling products.
Ingredients
Aqua/Water/Eau, Betaine, Cetearyl Alcohol, Cetyl Alcohol, Brassicamido-propyl Dimethylamine, Hydrogenated Polydecene, Moringa Oleifera Leaf Extract, Phyllanthus Emblica Fruit Extract, Ceramide NP, Ceramide EOP, Ceramide AP, Copper Tripeptide-1, Phytosphingosine, Serenoa Serrulata Fruit Extract, Phytosterols, Hydroxypropyl Bislauramide MEA, Hydroxypropyl Bisstearamide MEA, Hydroxypropylgluconamide, Hydroxypropylammonium Gluconate, Biotin, Potassium Olivate, Polyglyceryl-10 Stearate, Stearic Acid, Fragrance/Parfum, Polyquaternium-37 Propylene Glycol Dicaprylate/Dicaprate, PPG-1 Trideceth-6, Polyquaternium-7, Lactic Acid, Caprylyl Glycol, Ethylhexylglycerin, Sodium Benzoate, Potassium Sorbate, Polyacrylamide, Maltodextrin, Limonene
